电子数码显微镜

X射线检测机

超声扫描

扫描电镜和能谱分析

Inspect the appearance, cracks, contamination, scratches, oxide layer defects, etc. of the sample

Check bonding wires, chip connections and lead frames, voids, bubbles, etc

Check for layering between devices and chip cracks

Plan view and cross-sectional microstructure inspection of the sample, multi-layer sample inspection, and accurate critical size measurement; Qualitative and semi quantitative analysis of analytical elements on the surface of the sample

离子研磨机

热点定位分析系统

激光开帽机

切片研磨机

Fine machining of the mechanical polishing of the sample, with small cracks and voids

Detect abnormal leakage failure points on the surface of the chip, as well as abnormal short circuit points in the sample

Remove the compound, expose the bare film, and observe the bonding defects of the bare film or lead wire

Section display of sample structure, internal structure or abnormal points